surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by Pin Transfer Method. It has following features. 贴片胶用于在针转移法的波峰焊之前将电子元器件或其它的小型部件粘接在印刷电路板上.它具有以下特性.
l Low moisture absorption 潮气吸收率低
l Excellent green/wet strength 极佳的未固化/湿强度
l High dot profile and resists slumping and stringing 极好的点状外观，抗流淌和拉丝
l Broad equipment capability with high-volume screen printing 满足大体积丝网印刷的设备通用性
PROPERTIES OF UNCURED MATERIAL 固化前材料性能
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Property
性能
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Test Method
测试方法
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Color/Appearance 颜色/外观
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Visual
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Viscous Red Gel 粘稠红色凝胶
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Specific Gravity 密度, g/cc,
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ASTM D-792
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1.21
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Viscosity 粘度, (cP), 25℃
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ASTM D-2393
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~20,000
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Yield strength 屈服强度, cone & Plate, Pa, 25°C
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200-300
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TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能
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Property 性能
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Test Method 测试方法
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Value 数值
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Coefficient of thermal expansion 热膨胀系数, CTE
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ASTM D696
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140 E-06
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Thermal conductivity 热导率, w/m-k
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ASTM C177
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0.4
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Lap shear strength 搭接剪切强度, steel 钢, Mpa
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28
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Torque strength 扭转强度, FR4 PCB, N.mm
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50 - 80
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Volume resistivity 体电阻系数, ohms-cm
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ASTM D-257
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2.1 E+15
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Surface resistivity 表面电阻系数, ohms
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ASTM D-257
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2.0 E+15
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Dielectric constant 电介质常数
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ASTM D150
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3.7(1 kHz), 3.6(10 kHz)
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Torque retention 30 seconds @100°C + 3 seconds @260°C flux and wave solder 波峰焊中30秒 @100°C + 3秒@260°C的扭力保持
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100 %
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Hot solder dip @ 260°C 热浸焊@ 260°C
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Pass 通过
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DIRECTIONS FOR USE 使用方法
Typical curing condition 典型固化条件: 3 min. at 150 ºC 在150 ºC下保持3分钟
Curing starts above 100 ºC, with a DSC conversion of 90%, 5 min. at 125 ºC. 固化开始于100 ºC以上, 在125 ºC保温5分钟, 热转换为90%.
CLEANING 清除
Uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(IPA) or MEK. 未固化胶粘剂可被轻易从印刷电路板上用异丙醇或丁酮清除
Uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(IPA) or MEK. 未固化胶粘剂可被轻易从印刷电路板上用异丙醇或丁酮清除
STORAGE INFORMATION 保存方法
在5 ºC下密封干燥储存, 保质期为6个月
